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• May 13, 2026

  AI Server Market Update: Vendors Shift from Silicon to Services

  Data Center Knowledge reports that server vendors are shifting toward software, professional services, and AIOps to win enterprise AI customers.

  • Main announcement: Vendors including Dell, HPE, Lenovo, and Supermicro are emphasizing software management, professional services, AIOps, and liquid-cooling/packaged rack solutions to capture enterprise AI demand; IDC projects AI infrastructure spending to reach $487 billion in 2026 and surpass $1 trillion by 2029, while suppliers report large backlogs (e.g., Dell $43 billion AI backlog, HPE $5 billion AI systems backlog, Lenovo $15.5 billion AI server pipeline).
  • Background & details: The article is an industry analysis citing interviews and earnings: IDC reported the global server market at $444 billion (2025); vendors report specific results such as Dell $9 billion AI-optimized server revenue (Q4 FY2027) and Supermicro $10.2 billion sales (FYQ3 FY2026); it highlights enterprise skill gaps, GPU/memory supply constraints, and differentiation via integration, delivery speed, power & cooling, and services.
• May 8, 2026

  Supermicro’s New AI Campus Embodies the Industrialization of AI Infrastructure

  Supermicro announced the opening of its largest U.S. Data Center Building Block Solutions (DCBBS) campus near its San Jose headquarters on April 27, 2026.

  • Main announcement: The new DCBBS campus spans ~32.8 acres and more than 714,000 square feet, becomes Supermicro’s fourth Bay Area location, expands the company’s regional footprint to nearly 4 million square feet, and will support advanced system design, domestic manufacturing, testing, service, and global distribution for Supermicro’s AI infrastructure portfolio. The facility includes 10 MW of on‑campus power capacity and is positioned as a rack‑scale, liquid‑cooled AI integration and validation hub.
  • Background and related details: Supermicro frames this as a move from server manufacturing to rack-scale DCBBS integration, part of a global footprint spanning Taiwan, Malaysia, and the Netherlands; the company reported fiscal 2025 net sales of $22 billion (up from $15 billion the prior year), projected fiscal 2026 revenue of at least $33 billion, and in early May projected quarterly revenue of $11–$12.5 billion. On May 6, Supermicro signed a non-binding MOU with NANO Nuclear to explore pairing microreactor generation (KRONOS platform) with Supermicro’s liquid‑cooled AI systems (no commercial deployment timeline announced).
• Apr 7, 2026 · IT Brief Asia

  Nutanix adds AI & cloud tools amid infrastructure push

  Nutanix has announced additions to the Nutanix Cloud Platform including new AI, Kubernetes on bare-metal, expanded storage and cloud management capabilities.

  • Main announcement: Nutanix introduced Agentic AI (early access) and NKP Metal (early access), made Unified Storage 5.3 and Data Lens 2.0generally available, and released Nutanix Cloud Manager 2.0 GA; it also launched a Foundation Central appliance to simplify AHV deployment on servers from Cisco, Dell, Fujitsu, HPE and Lenovo and expanded synchronous DR support for Dell PowerFlex and integration for Everpure //c FlashArray. These features target AI workloads, bare-metal Kubernetes, air-gapped on-prem deployments, and multisite/multidomain cluster management.

  • Background and details: The updates address server and storage supply constraints and aim to broaden deployment options (on-premise, edge, public cloud) including AWS GovCloud support; other planned ecosystem support includes AMD GPU-accelerated servers, Dell PowerStore, NetApp ONTAP, Lenovo ThinkSystem, additional Cisco integrations, zero-copy migrations from VMware vSphere Virtual Volumes to AHV vDisks, and a certified integration between Nutanix Database Service and MongoDB Ops Manager.

• Mar 26, 2026

  Arm shifts course, moves into silicon business

  Arm has announced it will expand into production silicon and launched the Arm AGI CPU with Meta as lead partner and first customer.

  • Main announcement: Arm is entering production silicon with the new Arm AGI CPU, positioned as a CPU purpose-built for agentic AI data centers, co-developed with Meta; the chip is designed by Ampere and will be manufactured by TSMC on a 3-nanometer process node. Key product specs announced include up to 136 Arm Neoverse V3 cores per CPU, 6GB/s memory bandwidth per core at sub-100ns latency, 300W TDP, claims of >2x performance per rack versus x86, support for 1U air-cooled deployments up to 8,160 cores per rack and liquid-cooled systems delivering 45,000+ cores per rack. Early systems are available now, with broader availability expected in the second half of the year.
  • Background and partners: The chip was designed and manufactured by Ampere (acquired by SoftBank for $6.5 billion last year). Arm confirmed additional commercial momentum with partners/customers including Cerebras, Cloudflare, F5, OpenAI, Positron, Rebellions, SAP, and SK Telecom, and is working with OEM/ODM partners ASRock Rack, Lenovo, Quanta Computer, and Supermicro for system deliveries. Independent analyst commentary (Jim McGregor, Tirias Research) raised questions about benchmark comparators and emphasized the AGI CPU is targeted at AI/accelerator orchestration rather than general-purpose enterprise CPU use.
• Mar 25, 2026

  Why AI rack densities make liquid cooling nonnegotiable

  Sean Michael Kerner reports that the industry’s largest AI infrastructure operators have already deployed and standardized liquid cooling for future builds.

  • Main announcement/action:Major operators have moved to liquid cooling and standardized designs, including Google (liquid cooling across >2,000 TPU pod deployments at gigawatt scale), Microsoft (moved all new data center designs to closed-loop, zero-water-evaporation liquid cooling as of August 2024), and Meta (committed $800 million to a liquid-cooled AI data center campus in Indiana). Nvidia announced the Vera Rubin platform at CES January 2026 and confirmed customer availability in H2 2026, with Vera Rubin supporting 45°C warm-water single-phase direct liquid cooling that allows heat rejection via dry coolers rather than mechanical chillers.

  • Background and supporting details:Market size and forecasts: Dell’Oro Group reported the liquid-cooling market approached $3 billion in 2025 and is forecast to reach $7 billion by 2029; density thresholds per JLL: air adequate up to ~20 kW/rack, rear-door exchangers to ~100 kW, immersion above ~175 kW; technology notes: Shell received chip-maker certification for immersion fluids in May 2025 (Intel endorsement), two-phase immersion offers PUE 1.01–1.03 but relies on PFAS fluorocarbons (3M exited Novec/PFAS), and Lenovo’s Neptune direct-water platform has provided warm-water cooling since 2012. All facts are drawn from the article and its cited sources.

• Mar 23, 2026

  Super Micro Indictment Highlights AI Infrastructure Supply Chain Risks

  Super Micro Computer said co-founder and senior vice president Yih-Shyan “Wally” Liaw has resigned following a federal indictment that was unsealed on March 19 alleging a scheme to move systems containing Nvidia AI chips into China.

  • Main announcement:Yih-Shyan “Wally” Liaw resigned from Super Micro Computer following a federal indictment unsealed on March 19 that alleges a scheme to transfer systems containing Nvidia AI GPUs into China; the company publicly acknowledged the resignation in response to the indictment.
  • Background and context: The article documents how surging GPU demand, export controls, and supply-chain pressure intersect; analyst Matt Kimball highlights Super Micro’s historical positioning as a lower-cost, faster-to-market white-box vendor, raises concerns about governance and alleged ethical lapses, and notes that Nvidia was not implicated in the indictment.
• Mar 22, 2026

  Super Micro Indictment Highlights AI Infrastructure Supply Chain Risks

  Super Micro Computer announced the resignation of co-founder and senior vice president Yih-Shyan “Wally” Liaw following a federal indictment unsealed on March 19 alleging a scheme to move systems containing Nvidia AI chips into China.

  • Main action:Resignation of Yih-Shyan “Wally” Liaw after a federal indictment unsealed March 19 alleging an alleged scheme to transfer systems with Nvidia GPUs into China; the indictment document was linked in the article.
  • Background and context:Export controls on high-end GPUs, surging GPU demand, and Super Micro’s historical positioning as a faster, lower-cost white-box vendor (compared to Dell, HPE, Lenovo) are central; analysts (Matt Kimball) flagged supply-chain integrity, vendor governance, and procurement diversification as immediate implications for data center operators and enterprise buyers.
• Mar 17, 2026

  NVIDIA Debuts Vera CPU to Anchor Next Phase of AI Infrastructure

  Nvidia has launched the Vera CPU, a processor designed to serve as the orchestration/control plane for agentic AI, unveiled at GTC 2026.

  • Launch details: Vera was unveiled at GTC 2026; built on Nvidia Grace architecture with 88 custom Arm-based “Olympus” cores (each core can run two tasks via Spatial Multithreading), LPDDR5X memory delivering up to 1.2 TB/s bandwidth, and a second-generation Scalable Coherency Fabric; tightly integrated with Rubin GPUs via NVLink-C2C (up to 1.8 TB/s coherent bandwidth) and positioned as the host CPU for HGX Rubin NVL8 systems.
  • Scale & ecosystem: Rack-scale Vera systems support up to 256 liquid-cooled CPUs and >22,000 concurrent CPU environments; ecosystem and early adopters named include Meta Platforms, Alibaba, ByteDance, Oracle Cloud Infrastructure, CoreWeave, Nebius Group, Lambda, and OEMs Dell Technologies, HPE, Lenovo, Supermicro; Nvidia and analysts claim lower power than x86 and a design optimized for agentic and reinforcement-learning orchestration.
• Mar 10, 2026

  UK AI Infrastructure Startup Nscale Raised $2 Billion in Series C Funding at $14.6 Billion Valuation & Plans for IPO in 2026, Launched in 2024 by Founder Josh Payne, Investors Include Sandton Capital Partners, Kestrel 0x1, Blue Sky Capital Managers, Florence Capital, Blue Owl Managed Funds, Dell, Lenovo Fidelity Management & Research Company, G Squared, Nokia, Point72, T.Capital, Astra Capital Management, Citadel, Dell, Jane Street & Linden Advisors

  UK AI infrastructure startup Nscale has announced a $2 billion Series C raise at a $14.6 billion valuation and plans for an IPO in 2026.

  • Main announcement:Nscale raised $2 billion in Series C at a $14.6 billion valuation and plans an IPO in 2026; the company was launched in 2024 by founder Josh Payne and lists investors including Sandton Capital Partners, Kestrel 0x1, Blue Sky Capital Managers, Florence Capital, Blue Owl Managed Funds, Dell, Lenovo, Fidelity Management & Research Company, G Squared, Nokia, Point72, T.Capital, Astra Capital Management, Citadel, Jane Street, Linden Advisors.
  • Background and prior funding: Report references earlier rounds and investments: Series B $1.1 billion (Sept 2025), NVIDIA equity $674 million (£500 million) (Sept 2025), Series A $155 million (Dec 2024), and $30 million seed (Dec 2023); business description: sovereign-grade AI infrastructure with a fully vertically integrated suite and GW+ greenfield data centres across Europe and North America.
• Mar 9, 2026

  Nvidia-backed Nscale Soars to $14.6B Valuation After Latest Funding Round

  Nscale has announced a $2 billion Series C funding round that values the company at $14.6 billion, led by Aker ASA and 8090 Industries with participation from Nvidia, Lenovo, Astra Capital Management, Citadel, Dell, Jane Street, and Nokia.

  • Main announcement:Nscale raised $2 billion in a Series C round (largest single equity raise in Europe’s history) taking the company to a $14.6 billion valuation; the round was led by Aker ASA and 8090 Industries and included return funding from Nvidia, Lenovo, Astra Capital Management, Citadel, Dell, Jane Street, and Nokia.
  • Background and details:Nscale is a UK-based neocloud spun out of Arkon Energy in 2024, previously raised $1.1 billion Series B (backed by Nvidia, Aker, Nokia, Dell), has partnered on a $15 billion OpenAI/Nvidia effort to deploy 300,000 GPUs, announced a $865 million 10-year colocation commitment for a planned Madison, N.C. data center (part of adding “hundreds of megawatts” of capacity), and operates data centers in the US, UK, Norway, Portugal, and Iceland.
• Mar 6, 2026

  RDHx: A Simple, Affordable Path to Lower Data Center Energy Use

  The article explains RDHx (rear-door heat exchangers) as a practical rack-level retrofit option to reduce mechanical cooling energy in data centers.

  • Main announcement/action: The article describes RDHx as a drop-in retrofit that replaces a rack’s rear doors with a liquid-cooled coil, moves heat via a closed-loop liquid circuit to facility heat-rejection equipment (e.g., dry coolers, adiabatic coolers, or cooling towers), and typically starts at around $5,000 per rack. It also notes that RDHx can reduce mechanical cooling energy, enable higher supply temperatures, and in some designs allow chillerless operation.
  • Background and details: The piece compares passive vs. active doors (passive uses server fans; active includes integrated fans for more predictable heat transfer), positions RDHx relative to evaporative/adiabatic and direct-to-chip/immersion cooling (no per-rack water use and lower upfront cost than immersion), and highlights suitability constraints such as rack form factor, extreme rack densities, scale/rack count, and workload homogeneity. It also cites that data center energy use is projected to triple over the coming decade as a key driver for adoption.
• Feb 26, 2026

  Cooling’s New Reality: It’s Not Air vs. Liquid Anymore. It’s Architecture.

  Data Center Frontier (Matt Vincent) summarizes a batch of industry announcements and product launches that collectively reframe data center cooling as a full-stack systems engineering challenge.

  • Summary of main announcements: HRL Laboratories unveiled Low-Chill (Feb. 24, 2026), a single-phase direct liquid cooling approach developed under DOE/ARPA-E that claims +40% processor cooling or >10X reduction in pumping power, while Johnson Controls agreed to acquire Alloy Enterprises (Feb. 18, 2026) (expected to close in fiscal Q3; financial terms undisclosed). Carrier (Feb. 26, 2026) and Modine/Airedale (Jan. 22, 2026) launched chillers emphasizing –20°F to 140°F operating range, fast recovery, and hybrid free-cooling; Infinium (Jan. 15, 2026) launched Infinium Edge immersion platform; Boyd announced a manufacturing expansion in Juarez to ~460,000 sq ft (Feb. 17, 2026); Waste2Nano announced a wastewater-cooled AI platform targeting 10,000–20,000 m³/day (~5 MGD) initial deployment.
  • Background and supporting details: The article is a roundup/opinion-style synthesis (not a single primary press release) that compiles multiple company announcements and trade-show reveals from Jan–Feb 2026, highlights thermal metrics disclosed by HRL (e.g., 8.2 °C/kW thermal interface resistance; <1 psi pressure drop; <1% pumping power block-level; 70°C inlet) and firm product claims (Johnson Controls: up to 35% thermal efficiency improvement, up to 75% pressure-drop reduction). It notes regulatory/transaction timing (JCI/Alloy closing subject to regulatory approvals in fiscal Q3) and clarifies which items are product launches versus strategic acquisitions or manufacturing expansions.
• Feb 23, 2026

  Raising the temp on liquid cooling

  Nvidia CEO Jensen Huang announced that the Vera Rubin processor can be cooled with 45°C (113°F) water, asserting that this removes the need for water chillers in data centers.

  • Main announcement/action:Vera Rubin can be cooled at 45°C (113°F) so “no water chillers are necessary” (CES keynote); Vera Rubin is described as twice as powerful as the Grace Blackwell chip. The keynote claim is presented as a product/technology announcement by Nvidia at CES.
  • Background and supporting details:Industry adoption examples include IBM (2012 hot-water supercomputer), Lenovo (Neptune hot-water solution), and vendors Accelsius, LiquidStack, SuperMicro, Vertiv, and Schneider Electric supporting high-temperature liquid cooling. Market numbers from Dell’Oro: market ~$3 billion in 2025, projected ~$7 billion by 2029; McKinsey: direct-to-chip liquid cooling can use 31% less power; break-even for liquid cooling is 1–3 years depending on electricity costs. S&P/451 survey stats: 45% air-only, 42% hybrid, 12% fully liquid; 59% plan liquid cooling within five years, 21% within 12 months. Downsides cited: microbial growth, corrosion, operator comfort (facility air temperature), rooftop radiator space, and installation/maintenance costs.
• Jan 26, 2026

  Storage shortage may cause AI delays for enterprises

  Network World reports that enterprises are facing storage shortages, long lead times, and dramatic price increases driven by AI-related demand.

  • Main announcement: The article documents that enterprises are experiencing storage shortages, long lead times, and steep price increases (DRAM and NAND) driven by AI deployments; TrendForce and industry analysts predict DRAM up ~55–60% YoY and NAND up ~33–38%, with some market analysis expecting 50%+ increases and OEMs reporting multi-quarter supply constraints.
  • Background and details:Quoted timelines and figures include predictions of MLC NAND capacity falling 42% in 2026, SSD delivery delays exceeding one year, capacity contracts running to 2026/2027, and manufacturer remarks that a semiconductor plant takes ~15 months and costs $50 billion; Lenovo and industry analysts warn some component prices could rise up to four-fold versus early 2025 (example: a 64‑Gig DIMM moving from the “low two‑hundreds” to ~$800).