Amkor and NVIDIA expand U.S. advanced packaging capacity

Amkor Technology has announced a multi-year strategic partnership with NVIDIA to expand advanced semiconductor packaging and test capacity for AI infrastructure.

• NVIDIA will provide a prepayment supporting Amkor’s expansion of U.S. advanced packaging capacity, with the agreement described as a $1.5 billion multi-year advanced packaging and development agreement.
• The companies said they will align long-term roadmaps for high-density interconnects and heterogeneous integration; the collaboration also supports Amkor’s planned Arizona capacity expansion and broader U.S. supply-chain resilience.