Scalable liquid cooling essential for modern AI data centers

Boyd Corporation announces scalable liquid cooling solutions for data centers.

• Main announcement/action: Boyd highlights and promotes its scalable liquid cooling portfolio (modular cold plates, manifolds, CDUs, and reference liquid loops) as a ready-to-install foundation to accelerate deployment and reduce design risk for edge, colocation, and large AI-driven data centers; it also promotes its SmartCFD simulation software for network-wide thermal modeling.
• Background and details:Projected electricity demand ~448 TWh in 2025 (IEA/Gartner cites ~415 TWh in 2024 and expects demand to more than double by 2030); Boyd emphasizes global manufacturing capacity and regional service/field engineering across North America, Europe, and Asia, and lists specific product links (cold plates, liquid loops, CDUs) and engineering tools (SmartCFD).