TSMC expands advanced packaging capacity in Chiayi

          Overseas Community Affairs Council, Taiwan
          
            · July 14, 2026
          
          · ✓ verified

TSMC has announced an expansion of advanced packaging capacity in southern Taiwan with three new packaging fabs planned at Chiayi Science Park.

The announcement came during the groundbreaking ceremony for Phase II of Chiayi Science Park, which aims to become a major advanced chip packaging hub by 2031.
Phase I plants have already begun mass production this summer, and the completed park is expected to generate over US$9 billion in annual output.

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