Telehouse upgrades data centers with liquid cooling for AI

Telehouse Canada announced a major infrastructure upgrade including first-of-its-kind direct liquid-to-chip cooling in collaboration with Enwave to scale AI workloads and bring compute closer to end users.

• Main announcement: Telehouse Canada has introduced a major infrastructure upgrade that includes direct liquid-to-chip technology (delivered in collaboration with Enwave) to enable sustainable cooling, low-latency performance, and support for high-density AI deployments in a metro environment; the upgrade is described in Telehouse’s recent press release linked in the article.
• Background and details: The article cites IBM data that 42% of enterprise-scale companies (>1,000 employees) report active AI deployment; Telehouse’s upgrade reportedly removes up to 80 per cent of heat from high-power server components, reducing reliance on power-intensive CRACs and server fans, and is positioned to support private/hybrid deployments where sensitive data cannot be hosted in public clouds.