Telehouse Canada deploys direct liquid cooling for AI workloads

Telehouse Canada has announced the completion of a major infrastructure upgrade deploying direct liquid‑to‑chip cooling across its downtown Toronto, interconnection‑rich data center campus (press release dated May 12, 2026).

• Deployment details: Telehouse Canada deployed direct liquid cooling (direct liquid‑to‑chip) across its metro data center campus, enabling cabinet densities up to 120 kW per rack, supporting colocated high‑density AI inference deployments; the announcement is presented as a company press release dated May 12, 2026.
• Background and implementation specifics: The cooling system offloads up to 80% of heat from server components to a coolant loop, transfers heat into Enwave’s closed‑loop district energy system for reuse to heat Toronto’s municipal drinking water, reduces reliance on chillers (improving PUE and WUE), and engaged approximately 80 skilled professionals across construction and engineering during the project lifecycle.