TSMC

Recent news

• Aug 18, 2026

  Data Center Hardware Highlights: August 2026

  Data Center Knowledge has highlighted a shift in AI hardware coverage from GPUs toward infrastructure-first constraints across energy, minerals, grid access, and networking.

  • The roundup says AI buildouts are increasingly limited by power, copper, grid interconnects, transformers, turbines, and permitting, while rack-scale integration and the network supercycle are becoming more important.
  • The article also references several reported developments, including Nvidia’s $500B infrastructure bet, TSMC’s $265B Arizona campus expansion, and AMD’s Helios rack-scale AI system; it is commentary and synthesis rather than a single first-time corporate announcement.
• Aug 11, 2026

  IT infrastructure shortages are real and lasting. Here’s how to cope

  Network World has published an analysis of IT infrastructure shortages affecting enterprise AI, networking, storage, and compute planning.

  • The article cites analysts and vendors saying memory shortages are driving lead-time extensions to 6, 12, or 18 months, with memory prices up 50% to 200%, PC prices up 35% to 45%, and some server prices up over 125%.
  • It also reports enterprise network equipment pricing is projected to rise over 20% in 2026 and by a further 3% to 5% into 2027, with no price reduction expected until end-2027; examples and advice are drawn from Gartner, TD SYNNEX, WWT, Backblaze, Cisco, and Equinix.
• Aug 3, 2026

  AMD unveils AI GPU to challenge Nvidia’s Rubin

  AMD has announced the Instinct MI455X, its new flagship AI accelerator, at its recent Advancing AI 2026 event, alongside the Helios rack-scale AI platform.

  • The MI455X is the flagship of AMD’s Instinct MI400 family and is designed for large-scale AI training and inference; AMD says it delivers 320 billion transistors, 432GB HBM4, up to 40 PFLOPS FP4, and 23.3 TB/s of memory bandwidth.
  • The chip uses CDNA 5, is manufactured with TSMC 2nm and 3nm process technologies, and is intended to improve tensor processing, cache bandwidth, memory movement, and execution efficiency for LLM and agentic AI workloads; shipping begins in Q3 2026, with volume ramping through Q4 2026 and H1 2027.
• Jul 24, 2026

  TSMC Supplier Leases 151,000-Square-Foot Phoenix Facility

  Marketech International Corporation has finalized a lease for a 151,451-square-foot warehouse in Phoenix’s Deer Valley submarket, supporting its role as a contractor to TSMC.

  • Marketech International Corporation (MIC) leased a 151,451-square-foot warehouse at 950 West Rose Garden Lane in Phoenix’s Deer Valley submarket.
  • MIC is described as a key contractor supporting TSMC and its fabrication campus in North Phoenix; the article also says this is the fifth transaction Kidder Mathews has completed for MIC.
  • The piece references TSMC’s expansion in Arizona and says TSMC announced another $100 billion commitment last week, bringing the total to over $265 billion.
• Jul 19, 2026

  Taiwan Chipmaker TSMC Pledges Another $100B to Expand U.S. Chipmaking

  TSMC has announced plans to spend another $100 billion expanding its manufacturing capacity in the United States.

  • The company said the new commitment would bring its total pledged investment in U.S. chipmaking to $265 billion and likely fund four additional fabrication plants in Arizona focused on 2-nanometer and below chips.
  • TSMC also said it raised its 2026 capital expenditure budget to $60 billion-$64 billion from $52 billion-$56 billion and lifted its annual revenue growth forecast to slightly above 40%; the article also notes earlier U.S. commitments of $165 billion and a prior Taiwan-U.S. trade agreement tied to roughly $250 billion in new Taiwanese tech investments in the United States.
• Jul 16, 2026

  TSMC Expands Arizona Campus to $265B as AI Demand Surges

  Taiwan Semiconductor Manufacturing Co. has announced an additional $100 billion investment to expand its Arizona manufacturing campus, lifting its planned U.S. investment to $265 billion.

  • The expansion will add leading-edge semiconductor fabrication plants and advanced packaging facilities at the Arizona campus, according to Chairman and CEO C.C. Wei during Thursday’s earnings call.
  • TSMC also raised its 2026 capital spending budget to $60 billion to $64 billion from $52 billion to $56 billion and said full-year revenue should grow slightly more than 40% in U.S. dollar terms; the company’s second-quarter revenue reached NT$1.27 trillion ($40.2 billion).
• Jul 10, 2026

  Meta could start production of Iris AI chip in September – report

  Meta has reportedly planned to start production of its forthcoming AI chip Iris in September, according to a Reuters report citing an internal memo.

  • Iris production is slated to begin in September; the chip was one of the AI chips Meta unveiled in March and is intended to support generative AI inferencing workloads.
  • The memo says Iris took six weeks to test with no major issues; Meta worked with Broadcom on design and TSMC on manufacturing, and separately signed supply agreements with Samsung Electronics, SanDisk, and Sumitomo Electric for memory, flash storage, and fiber optic equipment.
  • Reuters also reported Meta plans to deploy 7GW in 2026 and 14GW by the end of 2027; Meta CFO Susan Li said capex would rise to $120 billion-$135 billion this year due in part to higher component pricing and additional data center costs.
• Jul 10, 2026 · TechNode Global

  Singapore Temasek bets big on AI: targets 10–15% AI allocation in portfolio by 2031

  Temasek has announced a plan to lift its direct AI exposure from about 6% of its portfolio to 10-15% by March 2031, as outlined in its Temasek Review 2026 statement by CEO Dilhan Pillay.

  • Direct AI exposure target: increase from about 6% to 10-15% by March 2031; current net portfolio value is S$518 billion ($402 billion) as at 31 March 2026.
  • Temasek said the target implies AI net worth of roughly S$52 billion to S$78 billion, up from about S$31 billion now, and that the remaining 85%-90% of the portfolio should focus on AI adoption for competitiveness.
• Jul 1, 2026

  Inference chip startup Etched emerges from stealth with $800m funding, unveils working chip

  Etched has launched from stealth, announcing $800 million in total funding, a working inference chip produced on TSMC’s N4P process, and more than $1 billion in customer contracts.

  • Main announcement & technology: Etched announced $800 million raised to date (including a $500 million round in December that set a $5 billion post‑money valuation), claims a working inference chip produced on TSMC N4P, and reports more than $1 billion in customer contracts; the company is validating a rack‑scale product that implements a shared low‑latency memory pool and an ultra‑low‑latency, high‑bandwidth interconnect.
  • Facilities, investors & timelines: Headquarters in San Jose; the company says it has stood up a factory in Taiwan and built a 2MW data centre, test house, and NPI prototyping lab at its California offices. Investors named include VentureTech Alliance, Jane Street, Hudson River Trading, Stripes, Radical Ventures, Primary VC, Peter Thiel, Andrej Karpathy, and Geoffrey Hinton; the most recent $500M round closed in December (post‑money valuation $5B).
• May 13, 2026

  Buckeye Mega Site Hits Market with $1B Economic Promise

  JLL’s Phoenix office announced it will market Grand View Arizona, a fully entitled, infrastructure-rich, 2,500-acre mega site in Buckeye, Arizona projected to generate over $1 billion in economic impact.

  • Main announcement: JLL Phoenix will market Grand View Arizona, a 2,500-acre, fully entitled mega site in Buckeye with 2.75 miles of Union Pacific rail frontage, highest availability of power, water and telecommunications, immediate access to Interstate 10 and the future Loop 303/State Route 30 interchange, and is projected to generate over $1 billion in economic impact. Marketing agents named include Marc Hertzberg, Anthony Lydon, Greg Matter, John Lydon and Nicole Marshall.
  • Background and project details: The site is located minutes from Phoenix-Goodyear Airport (≈11 miles) and Phoenix Sky Harbor Airport (≈30 miles), is adjacent to the Verrado and Teravalis master-planned communities, and is proximate to Verrado Marketplace (a $275 million development by Vestar); the announcement frames the site as suitable for large-scale manufacturing, logistics, data centers and advanced manufacturing.
• Mar 26, 2026

  Arm shifts course, moves into silicon business

  Arm has announced it will expand into production silicon and launched the Arm AGI CPU with Meta as lead partner and first customer.

  • Main announcement: Arm is entering production silicon with the new Arm AGI CPU, positioned as a CPU purpose-built for agentic AI data centers, co-developed with Meta; the chip is designed by Ampere and will be manufactured by TSMC on a 3-nanometer process node. Key product specs announced include up to 136 Arm Neoverse V3 cores per CPU, 6GB/s memory bandwidth per core at sub-100ns latency, 300W TDP, claims of >2x performance per rack versus x86, support for 1U air-cooled deployments up to 8,160 cores per rack and liquid-cooled systems delivering 45,000+ cores per rack. Early systems are available now, with broader availability expected in the second half of the year.
  • Background and partners: The chip was designed and manufactured by Ampere (acquired by SoftBank for $6.5 billion last year). Arm confirmed additional commercial momentum with partners/customers including Cerebras, Cloudflare, F5, OpenAI, Positron, Rebellions, SAP, and SK Telecom, and is working with OEM/ODM partners ASRock Rack, Lenovo, Quanta Computer, and Supermicro for system deliveries. Independent analyst commentary (Jim McGregor, Tirias Research) raised questions about benchmark comparators and emphasized the AGI CPU is targeted at AI/accelerator orchestration rather than general-purpose enterprise CPU use.
• Mar 25, 2026 · IT Brief Asia

  Transcelestial ranks among Fast Company's top innovators

  Transcelestial has been named among the top four companies on Fast Company’s Asia-Pacific Most Innovative Companies list for 2026.

  • Main announcement: Transcelestial (a Singapore- and US-based telecoms infrastructure company) was named in Fast Company’s Asia-Pacific top four for 2026 and is also included on Fast Company’s World’s Most Innovative Companies list; it was the only communications business in the regional ranking.
  • Details & background: The company describes its technology as a “planet-to-space internet” using laser communications; it says it has deployed more than 250km of production infrastructure, handles more than 2Tbps of capacity each day, and serves more than 12 telecom companies, several dozen ISPs and defence agencies across United States, Singapore, Japan, the Philippines, Taiwan, India and Indonesia. Fast Company’s editors assessed thousands of submissions for the annual ranking.
• Mar 20, 2026

  Nvidia overhauls the data center for OpenClaw era

  Nvidia announced a new integrated AI-native data-center architecture and full product stack at GTC, featuring GPU “Rubin”, CPU “Vera”, the Groq LPU inference chip, the Vera Rubin NVL72 server, NVLink at 260 terabytes/sec, BlueField-4 STX, Spectrum-X switch with co-packaged optics, and Dynamo orchestration software.

  • Main announcement: Nvidia unveiled a five-layer AI data-center blueprint (physical infrastructure, silicon, software/systems, AI models, applications) and specific products to implement it, including the Rubin GPU, Vera CPU, Groq LPU (inference-focused, high memory bandwidth), the Vera Rubin NVL72 server (combines Rubin and Groq LPU), NVLink doubled to 260 TB/s, and BlueField-4 STX to extend GPU memory; the architecture emphasizes reducing the cost of generating tokens and supporting KV Cache for contextual memory.
  • Background and details: The announcement was made at GTC (product and architecture reveal rather than a financial deal); Nvidia stated Spectrum-X with co-packaged optics is in production and credited TSMC for process technology; industry voices quoted include Jack Gold (J. Gold Associates) and Sandip Gupta (NTT Data) endorsing the value of an integrated stack and the operational simplicity it offers.
• Mar 19, 2026

  Tariffs Add Cost, but Component Shortages Dictate Data Center Timelines

  The article reports on fluctuating US tariffs and persistent component shortages affecting data center construction.

  • Key developments on tariffs (main announcement): The US Supreme Court in February 2026 invalidated portions of certain tariff measures, prompting the Trump administration to issue revised tariff measures while legal challenges continue; affected companies are suing to recover duties paid and litigation remains ongoing, creating uncertainty over import costs and duty recoveries.
  • Supply-chain and project-level details:DRAM and HBM are reported sold out through 2028, SSD and HDD availability is constrained (Western Digital capacity tight into 2027), and Micron has announced a planned $100 billion fabrication plant in New York; hyperscalers are absorbing most available accelerators and memory, and owners are shifting procurement (increase in OFCI — owner-furnished, contractor-installed) to manage extreme lead times.