TSMC

Recent news

• Jul 19, 2026

  Taiwan Chipmaker TSMC Pledges Another $100B to Expand U.S. Chipmaking

  TSMC has announced plans to spend another $100 billion expanding its manufacturing capacity in the United States.

  • The company said the new commitment would bring its total pledged investment in U.S. chipmaking to $265 billion and likely fund four additional fabrication plants in Arizona focused on 2-nanometer and below chips.
  • TSMC also said it raised its 2026 capital expenditure budget to $60 billion-$64 billion from $52 billion-$56 billion and lifted its annual revenue growth forecast to slightly above 40%; the article also notes earlier U.S. commitments of $165 billion and a prior Taiwan-U.S. trade agreement tied to roughly $250 billion in new Taiwanese tech investments in the United States.
• Jul 16, 2026

  TSMC Expands Arizona Campus to $265B as AI Demand Surges

  Taiwan Semiconductor Manufacturing Co. has announced an additional $100 billion investment to expand its Arizona manufacturing campus, lifting its planned U.S. investment to $265 billion.

  • The expansion will add leading-edge semiconductor fabrication plants and advanced packaging facilities at the Arizona campus, according to Chairman and CEO C.C. Wei during Thursday’s earnings call.
  • TSMC also raised its 2026 capital spending budget to $60 billion to $64 billion from $52 billion to $56 billion and said full-year revenue should grow slightly more than 40% in U.S. dollar terms; the company’s second-quarter revenue reached NT$1.27 trillion ($40.2 billion).
• Jul 10, 2026

  Meta could start production of Iris AI chip in September – report

  Meta has reportedly planned to start production of its forthcoming AI chip Iris in September, according to a Reuters report citing an internal memo.

  • Iris production is slated to begin in September; the chip was one of the AI chips Meta unveiled in March and is intended to support generative AI inferencing workloads.
  • The memo says Iris took six weeks to test with no major issues; Meta worked with Broadcom on design and TSMC on manufacturing, and separately signed supply agreements with Samsung Electronics, SanDisk, and Sumitomo Electric for memory, flash storage, and fiber optic equipment.
  • Reuters also reported Meta plans to deploy 7GW in 2026 and 14GW by the end of 2027; Meta CFO Susan Li said capex would rise to $120 billion-$135 billion this year due in part to higher component pricing and additional data center costs.
• Jul 10, 2026 · TechNode Global

  Singapore Temasek bets big on AI: targets 10–15% AI allocation in portfolio by 2031

  Temasek has announced a plan to lift its direct AI exposure from about 6% of its portfolio to 10-15% by March 2031, as outlined in its Temasek Review 2026 statement by CEO Dilhan Pillay.

  • Direct AI exposure target: increase from about 6% to 10-15% by March 2031; current net portfolio value is S$518 billion ($402 billion) as at 31 March 2026.
  • Temasek said the target implies AI net worth of roughly S$52 billion to S$78 billion, up from about S$31 billion now, and that the remaining 85%-90% of the portfolio should focus on AI adoption for competitiveness.
• Jul 1, 2026

  Inference chip startup Etched emerges from stealth with $800m funding, unveils working chip

  Etched has launched from stealth, announcing $800 million in total funding, a working inference chip produced on TSMC’s N4P process, and more than $1 billion in customer contracts.

  • Main announcement & technology: Etched announced $800 million raised to date (including a $500 million round in December that set a $5 billion post‑money valuation), claims a working inference chip produced on TSMC N4P, and reports more than $1 billion in customer contracts; the company is validating a rack‑scale product that implements a shared low‑latency memory pool and an ultra‑low‑latency, high‑bandwidth interconnect.
  • Facilities, investors & timelines: Headquarters in San Jose; the company says it has stood up a factory in Taiwan and built a 2MW data centre, test house, and NPI prototyping lab at its California offices. Investors named include VentureTech Alliance, Jane Street, Hudson River Trading, Stripes, Radical Ventures, Primary VC, Peter Thiel, Andrej Karpathy, and Geoffrey Hinton; the most recent $500M round closed in December (post‑money valuation $5B).
• May 13, 2026

  Buckeye Mega Site Hits Market with $1B Economic Promise

  JLL’s Phoenix office announced it will market Grand View Arizona, a fully entitled, infrastructure-rich, 2,500-acre mega site in Buckeye, Arizona projected to generate over $1 billion in economic impact.

  • Main announcement: JLL Phoenix will market Grand View Arizona, a 2,500-acre, fully entitled mega site in Buckeye with 2.75 miles of Union Pacific rail frontage, highest availability of power, water and telecommunications, immediate access to Interstate 10 and the future Loop 303/State Route 30 interchange, and is projected to generate over $1 billion in economic impact. Marketing agents named include Marc Hertzberg, Anthony Lydon, Greg Matter, John Lydon and Nicole Marshall.
  • Background and project details: The site is located minutes from Phoenix-Goodyear Airport (≈11 miles) and Phoenix Sky Harbor Airport (≈30 miles), is adjacent to the Verrado and Teravalis master-planned communities, and is proximate to Verrado Marketplace (a $275 million development by Vestar); the announcement frames the site as suitable for large-scale manufacturing, logistics, data centers and advanced manufacturing.
• Mar 26, 2026

  Arm shifts course, moves into silicon business

  Arm has announced it will expand into production silicon and launched the Arm AGI CPU with Meta as lead partner and first customer.

  • Main announcement: Arm is entering production silicon with the new Arm AGI CPU, positioned as a CPU purpose-built for agentic AI data centers, co-developed with Meta; the chip is designed by Ampere and will be manufactured by TSMC on a 3-nanometer process node. Key product specs announced include up to 136 Arm Neoverse V3 cores per CPU, 6GB/s memory bandwidth per core at sub-100ns latency, 300W TDP, claims of >2x performance per rack versus x86, support for 1U air-cooled deployments up to 8,160 cores per rack and liquid-cooled systems delivering 45,000+ cores per rack. Early systems are available now, with broader availability expected in the second half of the year.
  • Background and partners: The chip was designed and manufactured by Ampere (acquired by SoftBank for $6.5 billion last year). Arm confirmed additional commercial momentum with partners/customers including Cerebras, Cloudflare, F5, OpenAI, Positron, Rebellions, SAP, and SK Telecom, and is working with OEM/ODM partners ASRock Rack, Lenovo, Quanta Computer, and Supermicro for system deliveries. Independent analyst commentary (Jim McGregor, Tirias Research) raised questions about benchmark comparators and emphasized the AGI CPU is targeted at AI/accelerator orchestration rather than general-purpose enterprise CPU use.
• Mar 25, 2026 · IT Brief Asia

  Transcelestial ranks among Fast Company's top innovators

  Transcelestial has been named among the top four companies on Fast Company’s Asia-Pacific Most Innovative Companies list for 2026.

  • Main announcement: Transcelestial (a Singapore- and US-based telecoms infrastructure company) was named in Fast Company’s Asia-Pacific top four for 2026 and is also included on Fast Company’s World’s Most Innovative Companies list; it was the only communications business in the regional ranking.
  • Details & background: The company describes its technology as a “planet-to-space internet” using laser communications; it says it has deployed more than 250km of production infrastructure, handles more than 2Tbps of capacity each day, and serves more than 12 telecom companies, several dozen ISPs and defence agencies across United States, Singapore, Japan, the Philippines, Taiwan, India and Indonesia. Fast Company’s editors assessed thousands of submissions for the annual ranking.
• Mar 20, 2026

  Nvidia overhauls the data center for OpenClaw era

  Nvidia announced a new integrated AI-native data-center architecture and full product stack at GTC, featuring GPU “Rubin”, CPU “Vera”, the Groq LPU inference chip, the Vera Rubin NVL72 server, NVLink at 260 terabytes/sec, BlueField-4 STX, Spectrum-X switch with co-packaged optics, and Dynamo orchestration software.

  • Main announcement: Nvidia unveiled a five-layer AI data-center blueprint (physical infrastructure, silicon, software/systems, AI models, applications) and specific products to implement it, including the Rubin GPU, Vera CPU, Groq LPU (inference-focused, high memory bandwidth), the Vera Rubin NVL72 server (combines Rubin and Groq LPU), NVLink doubled to 260 TB/s, and BlueField-4 STX to extend GPU memory; the architecture emphasizes reducing the cost of generating tokens and supporting KV Cache for contextual memory.
  • Background and details: The announcement was made at GTC (product and architecture reveal rather than a financial deal); Nvidia stated Spectrum-X with co-packaged optics is in production and credited TSMC for process technology; industry voices quoted include Jack Gold (J. Gold Associates) and Sandip Gupta (NTT Data) endorsing the value of an integrated stack and the operational simplicity it offers.
• Mar 19, 2026

  Tariffs Add Cost, but Component Shortages Dictate Data Center Timelines

  The article reports on fluctuating US tariffs and persistent component shortages affecting data center construction.

  • Key developments on tariffs (main announcement): The US Supreme Court in February 2026 invalidated portions of certain tariff measures, prompting the Trump administration to issue revised tariff measures while legal challenges continue; affected companies are suing to recover duties paid and litigation remains ongoing, creating uncertainty over import costs and duty recoveries.
  • Supply-chain and project-level details:DRAM and HBM are reported sold out through 2028, SSD and HDD availability is constrained (Western Digital capacity tight into 2027), and Micron has announced a planned $100 billion fabrication plant in New York; hyperscalers are absorbing most available accelerators and memory, and owners are shifting procurement (increase in OFCI — owner-furnished, contractor-installed) to manage extreme lead times.
• Mar 18, 2026

  Jensen Huang After the Keynote: Inside Nvidia’s GTC 2026 Press Briefing

  Nvidia (Jensen Huang) framed the company as building “AI factories,” emphasizing inference, token economics, and ecosystem orchestration.

  • Main announcement: Jensen Huang presented Nvidia’s strategic shift to an inference- and token-centric model, arguing data centers must become “token manufacturing systems”, and confirming Nvidia is helping finance customer data center buildouts with partners including CoreWeave, Nscale, and Nebius. He cited a “trillion-dollar visibility” figure for Blackwell and Vera Rubin through 2027 (figure described as “trillion-dollar visibility” in the briefing).
  • Background and other details: Huang detailed Nvidia’s broader infrastructure role: co-inventing co-packaged optics with TSMC (~100 patents filed across the supply chain), production ramping for co-packaged optics, resumed manufacturing and license activity for H200 systems in China, and noted the complexity of relocating 40% of Taiwan chip capacity to the United States as a longer-term goal.
• Mar 17, 2026

  Jensen Huang Maps the AI Factory Era at NVIDIA GTC 2026

  Nvidia CEO Jensen Huang announced that AI is entering an infrastructure phase and unveiled hardware, software, and reference architectures to build gigawatt-scale “AI factories” for continuous inference.

  • Main announcement: Nvidia unveiled new infrastructure components including Grace Blackwell NVLink72, Vera Rubin (rack-scale systems with ~3.6 exaflops per rack and 45°C hot-water liquid cooling), the Vera Rubin DSX AI Factory reference architecture and Omniverse DSX digital-twin blueprint, and software layers OpenClaw / Nemo / Nemotron to orchestrate and secure agentic AI systems; Nvidia estimated a $1 trillion AI infrastructure market and cited an industry shift to continuous inference.
  • Details & partners: Nvidia described hybrid architectures integrating Groq accelerators (disaggregated inference via Dynamo orchestration), a production co-packaged optical switch built with TSMC, DSX integrations with partners (Cadence, Dassault Systèmes, Schneider Electric, Siemens, Vertiv, Trane Technologies, Switch) and energy partners (GE Vernova, Siemens Energy, Hitachi Energy, Emerald AI); the keynote also referenced venture funding > $150 billion for AI startups and examples like Nestlé reducing compute costs by 83% on a GPU-accelerated workload.
• Mar 17, 2026

  System-level ‘coopetition’: Why Nvidia’s DGX Rubin NVL8 runs on Intel Xeon 6

  Nvidia has announced that its DGX Rubin NVL8 systems will use Intel Xeon 6 (Xeon 6776P) processors as host CPUs.

  • Main announcement: Nvidia’s DGX Rubin NVL8 will be powered by Intel Xeon 6776P (Xeon 6) host CPUs, pairing eight Rubin GPUs with high-bandwidth memory and NVLink to support high-throughput, large-scale AI inference; the configuration and Intel tie-in were presented during GTC 2026.
  • Background and details:Nvidia purchased $5 billion of Intel shares in December 2025; Nvidia continues internal CPU development (Grace, Vera) while Intel advances GPUs and accelerators (Xe-based GPUs, Gaudi), and the Intel CPU choice is framed as preserving x86 compatibility, supply-chain optionality, and enterprise deployment readiness.
• Mar 10, 2026

  Eridu exits stealth with $200M to rebuild AI networking

  Eridu has launched out of stealth with more than $200 million in Series A funding to build custom silicon and a clean-sheet network switch for AI data center networking.

  • Main announcement: Eridu announced a Series A of more than $200 million (listed as $200 million in company summary) led by Socratic Partners with participation from John Doerr, Hudson River Trading, Capricorn Investment Group, and Matter Venture Partners; the company is headquartered in Saratoga, California, was founded in 2023, and plans to release more technical details and partnership announcements later in 2026.
  • Background and details: Eridu is founded by Drew Perkins (previously co-founded Lightera and Infinera) and has a partnership with TSMC for process technology and advanced system integration; the company has not disclosed product specifications or a GA date and is positioning its offering against incumbents Broadcom, Cisco, and Nvidia.