Samsung unveils next-gen 3D memory vision at FMS 2026

          Telborg
          
            · August 04, 2026
          
          · ✓ verified

Samsung Electronics Co., Ltd. has announced new AI memory technology concepts and a roadmap at FMS 2026 in Santa Clara, California.

The company unveiled zHBM and zNAND-O concept models, along with V10 BV-NAND featuring 400-plus layers and new wafer bonding technology.
Samsung said its AI memory roadmap includes HBM4E, HBM5, LPDDR5X-PIM and PM1763, and noted that its enterprise storage products are designed for AI data centers and future AI infrastructure.

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